2013 Graser User Conference (活動資料下載)
2013 Graser User Conference (8 / 13)，從 Silicon、Packaging 到 Board 具體 / 專業 / 效能的垂直整合，並透過 Cadence IC、Package 和 PCB 解決方案，大幅縮短產品設計時程，提升產業的競爭力。
藉由專業的精闢解說，快速了解全新 / 方便 / 快速的 IC 及 Package 模擬整合，以及為了因應現在 / 未來市場設計趨勢而生的 PCB 功能：ECAD-MCAD Co-Design、STEP Modeling、High Speed Auto-interactive Delay / Phase Tune 和 Prototype Technology。
除此之外，逐漸被產業所需要且重視的 Electrical Performance Analysis、Verification 和 Compliance Signoff，如何運用 Cadence Allegro Sigrity 的精準 / 快速模擬軟體，一次解決設計品質上的問題。
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• Predictions and Highlights in the WW • High End Consumer Electronics Design Challenges • Why Cadence for High End Consumer Electronics Hardware Design • What's New in 16.6 HotFix 006 |
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| New Perspective of V16.6 | |
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OrCAD New Enhancements |
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PSpice SLPS With New Apps |
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OrCAD SI for Electrical Constraints Determination |
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High-Speed Option (AiDT) |
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Allegro v16.6 New Enhancements |
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| Overcome The Challenge of High Performance with Low Cost Design | |
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Power Integrity |
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Channel Based Methods for Signal Integrity Evaluation |
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An Alternative for Design Checking through Electrical Performance Assessment |
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PDS Impact for DDR3-1600 Low Cost Design |
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| Integrate Your IC and Package Design Flow | |
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New!! Customize IC Design and Simulation Flow |
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Digital Design Flow Tips |
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Mixed-Signal Design for Analog-Centric & Digital-Centric Verification |
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Simple Transistor to Behavior Model Conversion |
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Chip, Package , Board Co-Simulation for 3D/2.5D IC Design |
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